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d a t a sh eet product speci?cation supersedes data of 1996 mar 11 file under integrated circuits, ic03 1996 jul 15 integrated circuits tea1094; tea1094a hands free ic
1996 jul 15 2 philips semiconductors product speci?cation hands free ic tea1094; tea1094a features low power consumption power-down function (tea1094a only) microphone channel with: C externally adjustable gain C microphone mute function. loudspeaker channel with: C externally adjustable gain C dynamic limiter to prevent distortion C rail-to-rail output stage for single-ended load drive C logarithmic volume control via linear potentiometer C loudspeaker mute function. duplex controller consisting of: C signal envelope and noise envelope monitors for both channels with: externally adjustable sensitivity externally adjustable signal envelope time constant externally adjustable noise envelope time constant C decision logic with: externally adjustable switch-over timing externally adjustable idle mode timing externally adjustable dial tone detector in receive channel C voice switch control with: adjustable switching range constant sum of gain during switching constant sum of gain at different volume settings. applications mains, battery or line-powered telephone sets with hands-free/listening-in functions cordless telephones answering machines fax machines. general description the tea1094 and tea1094a are bipolar circuits intended for use in mains, battery or line-powered telephone sets, cordless telephones, answering machines and fax machines. in conjunction with a member of the tea106x, tea111x families of transmission circuits, the devices offer a hands-free function. they incorporate a microphone amplifier, a loudspeaker amplifier and a duplex controller with signal and noise monitors on both channels. ordering information type number package name description version tea1094 dip28 plastic dual in-line package; 28 leads (600 mil) sot117-1 tea1094a dip24 plastic dual in-line package; 24 leads (600 mil) sot101-1 tea1094t so28 plastic small outline package; 28 leads; body width 7.5 mm sot136-1 TEA1094AT so24 plastic small outline package; 24 leads; body width 7.5 mm sot137-1 tea1094am ssop24 plastic shrink small outline package; 24 leads; body width 5.3 mm sot340-1
1996 jul 15 3 philips semiconductors product speci?cation hands free ic tea1094; tea1094a quick reference data v bb =5v; v gnd = 0 v; f = 1 khz; t amb =25 c; mutet = low; pd = low (tea1094a only); r l =50 w ; r vol =0 w ; measured in test circuit of fig.12; unless otherwise speci?ed. note 1. corresponds to 200 mw output power. symbol parameter conditions min. typ. max. unit v bb supply voltage 3.3 - 12.0 v i bb current consumption from pin v bb - 3.1 4.4 ma g vtx voltage gain from pin mic to pin mout in transmit mode v mic = 1 mv (rms); r gat = 30.1 k w 13 15.5 18 db d g vtxr voltage gain adjustment with r gat - 15.5 - +15.5 db g vrx voltage gain in receive mode; the difference between rin1 and rin2 to lsp v rin = 20 mv (rms); r gar = 66.5 k w ; r l =50 w 16 18.5 21 db d g vrxr voltage gain adjustment with r gar - 18.5 - +14.5 db v o(p-p) output voltage (peak-to-peak value) v rin = 150 mv (rms); r gar = 374 k w ; r l =33 w ; v bb = 9.0 v; note 1 - 7.5 - v swra switching range - 40 - db d swra switching range adjustment with r swr referenced to r swr = 365 k w - 40 - +12 db t amb operating ambient temperature - 25 - +75 c
1996 jul 15 4 philips semiconductors product speci?cation hands free ic tea1094; tea1094a block diagram fig.1 block diagram. handbook, full pagewidth mge436 log buff buff log buff buff logic v i i v voice switch dynamic limiter volume control i v v i dlc/muter lsp gar rsen renv rnoi tnoi tenv tsen mic mutet vol rin2 rin1 swr stab swt idt micgnd mout gat gnd v bb pd (1) 10 (7) (13) 19 (15) 22 (18) 28 (24) 27 (23) 26 (22) 23 (19) 24 (20) 25 (21) 5 (4) 6 (5) 1 (1) 8 (6) 21 (17) 20 (16) 18 (14) 16 (12) 14 (11) 13 (10) 12 (9) 2 (2) 2 3 (3) 11 (8) 13 mv attenuator 13 mv v dt v ref v bb v bb c mic r mic r tsen c tsen c tenv c tnoi c rnoi c renv r rsen c rsen r gar c lsp c dlc r gat to tea106x r idt c swt r stab r swr from tea106x r vol loudspeaker channel duplex controller microphone channel tea1094 tea1094a the pin numbers given in parenthesis are for the tea1094a. (1) tea1094a only.
1996 jul 15 5 philips semiconductors product speci?cation hands free ic tea1094; tea1094a pinning symbol pins description tea1094 tea1094a dlc/ muter 1 1 dynamic limiter timing adjustment; receiver channel mute input rin1 2 2 receiver ampli?er input 1 rin2 3 3 receiver ampli?er input 2 n.c. 4 - not connected gar 5 4 receiver gain adjustment lsp 6 5 loudspeaker ampli?er output n.c. 7 - not connected gnd 8 6 ground reference n.c. 9 - not connected v bb 10 7 supply voltage vol 11 8 receiver volume adjustment swr 12 9 switching range adjustment stab 13 10 reference current adjustment swt 14 11 switch-over timing adjustment n.c. 15 - not connected idt 16 12 idle mode timing adjustment pd - 13 power-down input n.c. 17 - not connected micgnd 18 14 ground reference for the microphone ampli?er mutet 19 15 transmit channel mute input mout 20 16 microphone ampli?er output gat 21 17 microphone gain adjustment mic 22 18 microphone input rnoi 23 19 receive noise envelope timing adjustment renv 24 20 receive signal envelope timing adjustment rsen 25 21 receive signal envelope sensitivity adjustment tnoi 26 22 transmit noise envelope timing adjustment tenv 27 23 transmit signal envelope timing adjustment tsen 28 24 transmit signal envelope sensitivity adjustment
1996 jul 15 6 philips semiconductors product speci?cation hands free ic tea1094; tea1094a fig.2 pin configuration (tea1094). handbook, halfpage dlc/muter rin1 rin2 n.c. gar lsp n.c. gnd n.c. v bb vol swr stab swt tsen tenv tnoi rsen rnoi mic renv gat mout mutet micgnd n.c. idt n.c. 1 2 3 4 5 6 7 8 9 10 11 12 13 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 tea1094 mge434 fig.3 pin configuration (tea1094a). handbook, halfpage dlc/muter rin1 rin2 gar lsp gnd v bb vol swr stab swt idt tsen tenv tnoi rsen rnoi mic renv gat mout mutet micgnd pd 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 tea1094a mge435 functional description general the values given in the functional description are typical values unless otherwise specified. a principle diagram of the tea106x is shown on the left side of fig.4. the tea106x is a transmission circuit of the tea1060 family intended for hand-set operation. it incorporates a receiving amplifier for the earpiece, a transmit amplifier for the microphone and a hybrid. for more details on the tea1060 family, please refer to data handbook ic03 . the right side of fig.4 shows a principle diagram of the tea1094 and tea1094a, hands-free add-on circuits with a microphone amplifier, a loudspeaker amplifier and a duplex controller. as can be seen from fig.4, a loop is formed via the sidetone network in the transmission circuit and the acoustic coupling between loudspeaker and microphone of the hands-free circuit. when this loop gain is greater than 1, howling is introduced. in a full duplex application, this would be the case. the loop-gain has to be much lower than 1 and therefore has to be decreased to avoid howling. this is achieved by the duplex controller. the duplex controller of the tea1094 and tea1094a detects which channel has the largest signal and then controls the gain of the microphone amplifier and the loudspeaker amplifier so that the sum of the gains remains constant. as a result, the circuit can be in three stable modes: 1. transmit mode (tx mode). the gain of the microphone amplifier is at its maximum and the gain of the loudspeaker amplifier is at its minimum. 2. receive mode (rx mode). the gain of the loudspeaker amplifier is at its maximum and the gain of the microphone amplifier is at its minimum. 3. idle mode. the gain of the amplifiers is halfway between their maximum and minimum value. the difference between the maximum gain and minimum gain is called the switching range.
1996 jul 15 7 philips semiconductors product speci?cation hands free ic tea1094; tea1094a fig.4 hands-free telephone set principles. handbook, full pagewidth mge438 duplex control hybrid telephone line sidetone acoustic coupling tea106x tea1094 tea1094a supply: pins v bb , gnd and pd the tea1094 and tea1094a must be supplied with an external stabilized voltage source between pins v bb and gnd. in the idle mode, without any signal, the internal supply current is 3.1 ma at v bb =5v. to reduce the current consumption during pulse dialling or register recall (flash), the tea1094a is provided with a power-down (pd) input. when the voltage on pd is high the current consumption from v bb is 180 m a. microphone channel: pins mic, gat, mout, micgnd and mutet (see fig.5) the tea1094 and tea1094a have an asymmetrical microphone input mic with an input resistance of 20 k w . the gain of the input stage varies according to the mode of the tea1094 and tea1094a. in the transmit mode, the gain is at its maximum; in the receive mode, it is at its minimum and in the idle mode, it is halfway between maximum and minimum. switch-over from one mode to the other is smooth and click-free. the output capability at pin mout is 20 m a (rms). in the transmit mode, the overall gain of the microphone amplifier (from pins mic to mout) can be adjusted from 0 db up to 31 db to suit specific application requirements. the gain is proportional to the value of r gat and equals 15.5 db with r gat = 30.1 k w . a capacitor must be connected in parallel with r gat to ensure stability of the microphone amplifier. together with r gat , it also provides a first-order low-pass filter. by applying a high level on pin mutet, the microphone amplifier is muted and the tea1094 and tea1094a are automatically forced into the receive mode.
1996 jul 15 8 philips semiconductors product speci?cation hands free ic tea1094; tea1094a fig.5 microphone channel. handbook, full pagewidth mgd343 v i i v c mic v bb r mic mutet mic from voice switch to envelope detector micgnd mout gat 21 (17) 19 (15) 22 (18) 20 (16) 18 (14) to tea106x r gat c gat to logic the pin numbers given in parenthesis refer to the tea1094a. loudspeaker channel fig.6 loudspeaker channel. handbook, full pagewidth mge437 dynamic limiter volume control i v v i dlc/muter lsp gar vol rin2 rin1 5 (4) 6 (5) 1 (1) 2 2 (2) 3 (3) 11 (8) v bb r gar c gar c lsp c dlc from tea106x r vol to logic to/from voice switch to envelope detector the pin numbers given in parenthesis refer to the tea1094a.
1996 jul 15 9 philips semiconductors product speci?cation hands free ic tea1094; tea1094a l oudspeaker amplifier : pins rin1, rin2, gar and lsp the tea1094 and tea1094a have symmetrical inputs for the loudspeaker amplifier with an input resistance of 40 k w between rin1 and rin2 (2 20 k w ). the input stage can accommodate signals up to 390 mv (rms) at room temperature for 2% of total harmonic distortion (thd). the gain of the input stage varies according to the mode of the tea1094 and tea1094a. in the receive mode, the gain is at its maximum; in the transmit mode, it is at its minimum and in the idle mode, it is halfway between maximum and minimum. switch-over from one mode to the other is smooth and click-free. the rail-to-rail output stage is designed to power a loudspeaker connected as a single-ended load (between lsp and gnd). in the receive mode, the overall gain of the loudspeaker amplifier can be adjusted from 0 db up to 33 db to suit specific application requirements. the gain from rin1 and rin2 to lsp is proportional to the value of r gar and equals 18.5 db with r gar = 66.5 k w . a capacitor connected in parallel with r gar can be used to provide a first-order low-pass filter. v olume control : pin vol the loudspeaker amplifier gain can be adjusted with the potentiometer r vol . a linear potentiometer can be used to obtain logarithmic control of the gain at the loudspeaker amplifier. each 950 w increase of r vol results in a gain loss of 3 db. the maximum gain reduction with the volume control is internally limited to the switching range. d ynamic limiter : pin dlc/ muter the dynamic limiter of the tea1094 and tea1094a prevents clipping of the loudspeaker output stage and protects the operation of the circuit when the supply voltage at v bb falls below 2.9 v. hard clipping of the loudspeaker output stage is prevented by rapidly reducing the gain when the output stage starts to saturate. the time in which gain reduction is effected (clipping attack time) is approximately a few milliseconds. the circuit stays in the reduced gain mode until the peaks of the loudspeaker signals no longer cause saturation. the gain of the loudspeaker amplifier then returns to its normal value within the clipping release time (typically 250 ms). both attack and release times are proportional to the value of the capacitor c dlc . the total harmonic distortion of the loudspeaker output stage, in reduced gain mode, stays below 5% up to 10 db (minimum) of input voltage overdrive [providing v rin is below 390 mv (rms)]. when the supply voltage drops below an internal threshold voltage of 2.9 v, the gain of the loudspeaker amplifier is rapidly reduced (approximately 1 ms). when the supply voltage exceeds 2.9 v, the gain of the loudspeaker amplifier is increased again. by forcing a level lower than 0.2 v on pin dlc/ muter, the loudspeaker amplifier is muted and the tea1094 (tea1094a) is automatically forced into the transmit mode. duplex controller s ignal and noise envelope detectors : pins tsen, tenv, tnoi, rsen, renv and rnoi the signal envelopes are used to monitor the signal level strength in both channels. the noise envelopes are used to monitor background noise in both channels. the signal and noise envelopes provide inputs for the decision logic. the signal and noise envelope detectors are shown in fig.7. for the transmit channel, the input signal at mic is 40 db amplified to tsen. for the receive channel, the differential signal between rin1 and rin2 is 0 db amplified to rsen. the signals from tsen and rsen are logarithmically compressed and buffered to tenv and renv respectively. the sensitivity of the envelope detectors is set with r tsen and r rsen . the capacitors connected in series with the two resistors block any dc component and form a first-order high-pass filter. in the basic application, see fig.13, it is assumed that v mic = 1 mv (rms) and v rin = 100 mv (rms) nominal and both r tsen and r rsen have a value of 10 k w . with the value of c tsen and c rsen at 100 nf, the cut-off frequency is at 160 hz. the buffer amplifiers leading the compressed signals to tenv and renv have a maximum source current of 120 m a and a maximum sink current of 1 m a. together with the capacitor c tenv and c renv , the timing of the signal envelope monitors can be set. in the basic application, the value of both capacitors is 470 nf. because of the logarithmic compression, each 6 db signal increase means 18 mv increase of the voltage on the envelopes tenv or renv at room temperature. thus, timings can be expressed in db/ms. at room temperature, the 120 m a sourced current corresponds to a maximum rise-slope of the signal envelope of 85 db/ms. this is sufficient to track normal speech signals. the 1 m a current sunk by tenv or renv corresponds to a maximum fall-slope of 0.7 db/ms. this is sufficient for a smooth envelope and also eliminates the effect of echoes on switching behaviour.
1996 jul 15 10 philips semiconductors product speci?cation hands free ic tea1094; tea1094a to determine the noise level, the signals on tenv and renv are buffered to tnoi and rnoi. these buffers have a maximum source current of 1 m a and a maximum sink current of 120 m a. together with the capacitors c tnoi and c rnoi , the timing can be set. in the basic application of fig.13 the value of both capacitors is 4.7 m f. at room temperature, the 1 m a sourced current corresponds to a maximum rise-slope of the noise envelope of approximately 0.07 db/ms. this is small enough to track background noise and not to be influenced by speech bursts. the 120 m a current that is sunk corresponds to a maximum fall-slope of approximately 8.5 db/ms. however, during the decrease of the signal envelope, the noise envelope tracks the signal envelope so it will never fall faster than approximately 0.7 db/ms. the behaviour of the signal envelope and noise envelope monitors is illustrated in fig.8. fig.7 signal and noise envelope detectors. handbook, full pagewidth mgd223 log 28 (24) 27 (23) 26 (22) 25 (21) 24 (20) 23 (19) log from microphone amplifier from loudspeaker amplifier duplex controller tsen r tsen c tsen c tenv c tnoi r rsen c rsen c renv c rnoi tenv tnoi rsen renv rnoi to logic to logic the pin numbers given in parenthesis refer to the tea1094a. handbook, full pagewidth mbg354 input signal signal envelope noise envelope 4 mv (rms) 1 mv (rms) a c c 36 mv 36 mv b b b a b time a: 85 db/ms b: 0.7 db/ms b: 0.7 db/ms c: 0.07 db/ms fig.8 signal and noise envelope waveforms.
1996 jul 15 11 philips semiconductors product speci?cation hands free ic tea1094; tea1094a d ecision logic : pins idt and swt fig.9 decision logic. the pin numbers given in parenthesis refer to the tea1094a. (1) when mutet = high, +10 m a is forced. when dlc/ muter < 0.2 v, - 10 m a is forced. handbook, full pagewidth mgd224 13 mv 13 mv tenv tnoi renv mutet from dynamic limiter rnoi v dt xx11 - 10 m a + 10 m a + 10 m a x10x 1x0x xx10 0 000x 0 v ref r idt c swt swt 16 (12) 14 (11) 27 (23) 26 (22) 24 (20) 23 (19) 19 (15) idt duplex controller logic (1) attenuator the tea1094 and tea1094a select their modes of operation (transmit, receive or idle mode) by comparing the signal and the noise envelopes of both channels. this is executed by the decision logic. the resulting voltage on pin swt is the input for the voice-switch. to facilitate the distinction between signal and noise, the signal is considered as speech when its envelope is more than 4.3 db above the noise envelope. at room temperature, this is equal to a voltage difference v env - v noi = 13 mv. this so called speech/noise threshold is implemented in both channels. the signal on mic contains both speech and the signal coming from the loudspeaker (acoustic coupling). when receiving, the contribution from the loudspeaker overrules the speech. as a result, the signal envelope on tenv is formed mainly by the loudspeaker signal. to correct this, an attenuator is connected between tenv and the tenv/renv comparator. its attenuation equals that applied to the microphone amplifier. when a dial tone is present on the line, without monitoring, the tone would be recognized as noise because it is a signal with a constant amplitude. this would cause the tea1094 (tea1094a) to go into the idle mode and the user of the set would hear the dial tone fade away. to prevent this, a dial tone detector is incorporated which, in standard applications, does not consider input signals between rin1 and rin2 as noise when they have a level greater than 127 mv (rms). this level is proportional to r rsen .
1996 jul 15 12 philips semiconductors product speci?cation hands free ic tea1094; tea1094a as can be seen from fig.9, the output of the decision logic is a current source. the logic table gives the relationship between the inputs and the value of the current source. it can charge or discharge the capacitor c swt with a current of 10 m a (switch-over). if the current is zero, the voltage on swt becomes equal to the voltage on idt via the high-ohmic resistor r idt (idling). the resulting voltage difference between swt and idt determines the mode of the tea1094 (tea1094a) and can vary between - 400 and +400 mv (see table 1). table 1 modes of tea1094; tea1094a the switch-over timing can be set with c swt , the idle mode timing with c swt and r idt . in the basic application given in fig.13, c swt is 220 nf and r idt is 2.2 m w . this enables a switch-over time from transmit to receive mode or vice-versa of approximately 13 ms (580 mv swing on swt). the switch-over time from idle mode to transmit mode or receive mode is approximately 4 ms (180 mv swing on swt). the switch-over time, from receive mode or transmit mode to idle mode, is equal to 4 r idt c swt and is approximately 2 seconds (idle mode time). the inputs mutet and dlc/ muter overrule the decision logic. when mutet goes high, the capacitor c swt is charged with 10 m a thus resulting in the receive mode. when the voltage on pin dlc/ muter goes lower than 0.2 v, the capacitor c swt is discharged with 10 m a thus resulting in the transmit mode. v oice - switch : pins stab and swr a diagram of the voice-switch is illustrated in fig.10. with the voltage on swt, the tea1094 (tea1094a) voice-switch regulates the gains of the transmit and the receive channel so that the sum of both is kept constant. in the transmit mode, the gain of the microphone amplifier is at its maximum and the gain of the loudspeaker amplifier is at its minimum. in the receive mode, the opposite applies. in the idle mode, both microphone and loudspeaker amplifier gains are halfway. v swt - v idt (mv) mode < - 180 transmit mode 0 idle mode >180 receive mode the difference between maximum and minimum is the so called switching range. this range is determined by the ratio of r swr and r stab and is adjustable between 0 and 52 db. r stab should be 3.65 k w and sets an internally used reference current. in the basic application diagram given in fig.13, r swr is 365 k w which results in a switching range of 40 db. the switch-over behaviour is illustrated in fig.11. in the receive mode, the gain of the loudspeaker amplifier can be reduced using the volume control. since the voice-switch keeps the sum of the gains constant, the gain of the microphone amplifier is increased at the same time (see dashed curves in fig.11). in the transmit mode, however, the volume control has no influence on the gain of the microphone amplifier or the gain of the loudspeaker amplifier. consequently, the switching range is reduced when the volume is reduced. at maximum reduction of volume, the switching range becomes 0 db. fig.10 voice switch. the pin numbers given in parenthesis refer to the tea1094a. (1) c = constant. g vtx + g vrx = c (1) voice switch r stab r swr stab 13 (10) 12 (9) swr to microphone amplifier from swt from volume control to loudspeaker amplifier duplex controller mgd225
1996 jul 15 13 philips semiconductors product speci?cation hands free ic tea1094; tea1094a limiting values in accordance with the absolute maximum rating system (iec 134). symbol parameter conditions min. max. unit v n(max) maximum voltage on all pins; except pins v bb , rin1 and rin2 v gnd - 0.4 v bb + 0.4 v v rin(max) maximum voltage on pins rin1 and rin2 v gnd - 1.2 v bb + 0.4 v v bb(max) maximum voltage on pin v bb v gnd - 0.4 12.0 v p tot total power dissipation t amb =75 c tea1094 - 1000 mw tea1094a - 910 mw tea1094t - 625 mw TEA1094AT - 590 mw tea1094am - 438 mw t stg ic storage temperature - 40 +125 c t amb operating ambient temperature - 25 +75 c fig.11 switch-over behaviour. handbook, halfpage - 400 - 200 0 + 400 + 200 g vtx, g vrx v swt - v idt (mv) g vtx r vol ( w ) 5700 3800 idle mode 1900 0 0 1900 3800 5700 (10 db/div) tx mode rx mode g vrx mbg351
1996 jul 15 14 philips semiconductors product speci?cation hands free ic tea1094; tea1094a thermal characteristics characteristics v bb =5v; v gnd = 0 v; f = 1 khz; t amb =25 c; mutet = low; pd = low (tea1094a only); r l =50 w ; r vol =0 w ; measured in test circuit of fig.12; unless otherwise speci?ed. symbol parameter value unit r th j-a thermal resistance from junction to ambient in free air tea1094 45 k/w tea1094a 50 k/w tea1094t 70 k/w TEA1094AT 75 k/w tea1094am 104 k/w symbol parameter conditions min. typ. max. unit supply (v bb , gnd and pd) v bb supply voltage 3.3 - 12.0 v i bb current consumption from pin v bb - 3.1 4.4 ma p ower - down input pd (tea1094a only ) v il low level input voltage v gnd - 0.4 - 0.3 v v ih high level input voltage 1.5 - v bb + 0.4 v i pd input current pd = high - 2.5 5 m a i bb(pd) current consumption from pin v bb in power-down condition pd = high - 180 240 m a microphone channel (mic, gat, mout, mutet and micgnd) m icrophone amplifier | z i | input impedance between pins mic and micgnd 17 20 23 k w g vtx voltage gain from pin mic to mout in transmit mode v mic = 1 mv (rms) 13 15.5 18 db d g vtxr voltage gain adjustment with r gat - 15.5 - +15.5 db d g vtxt voltage gain variation with temperature referenced to 25 c v mic = 1 mv (rms); t amb = - 25 to +75 c - 0.3 - db d g vtxf voltage gain variation with frequency referenced to 1 khz v mic = 1 mv (rms); f = 300 to 3400 hz - 0.3 - db v notx noise output voltage at pin mout pin mic connected to micgnd through 200 w in series with 10 m f; psophometrically weighted (p53 curve) -- 100 - dbmp
1996 jul 15 15 philips semiconductors product speci?cation hands free ic tea1094; tea1094a t ransmit mute input mutet v il low level input voltage v gnd - 0.4 - 0.3 v v ih high level input voltage 1.5 - v bb + 0.4 v i mutet input current mutet = high - 2.5 5 m a d g vtxm voltage gain reduction with mutet active mutet = high - 80 - db loudspeaker channel (rin1, rin2, gar, lsp and dlc/ muter) l oudspeaker amplifier | z i | input impedance between pins rin1 or rin2 and gnd 17 20 23 k w between pins rin1 and rin2 34 40 46 k w g vrx voltage gain in receive mode; between rin1 and rin2 to lsp v rin = 20 mv (rms) 16 18.5 21 db d g vrxr voltage gain adjustment with r gar - 18.5 - +14.5 db d g vrxt voltage gain variation with temperature referenced to 25 c v rin = 20 mv (rms); t amb = - 25 to +75 c - 0.3 - db d g vrxf voltage gain variation with frequency referenced to 1 khz v rin = 20 mv (rms); f = 300 to 3400 hz - 0.3 - db v rin(rms) maximum input voltage between rin1 and rin2 (rms value) r gar = 11.8 k w ; for 2% thd in input stage - 390 - mv v norx(rms) noise output voltage at pin lsp (rms value) inputs rin1 and rin2 short-circuited through 200 w in series with 10 m f; psophometrically weighted (p53 curve) - 80 -m v cmrr common mode rejection ratio - 50 - db d g vrxv voltage gain variation related to d r vol = 950 w when total attenuation does not exceed the switching range - 3 - db o utput capability v ose(p-p) output voltage (peak-to-peak value) v rin = 300 mv (rms); note 1 3.5 4.5 - v v rin = 150 mv (rms); r gar = 374 k w ; r l =33 w ; v bb = 9.0 v; note 2 - 7.5 - v i om maximum output current at lsp (peak value) 150 500 - ma symbol parameter conditions min. typ. max. unit
1996 jul 15 16 philips semiconductors product speci?cation hands free ic tea1094; tea1094a d ynamic limiter t att attack time when v rin jumps from 20 mv to 20 mv + 10 db r gar = 374 k w-- 5ms t rel release time when v rin jumps from 20 mv + 10 db to 20 mv r gar = 374 k w- 250 - ms thd total harmonic distortion at v rin =20mv+10db r gar = 374 k w ; t > t att - 0.9 5 % v bb(th) v bb limiter threshold - 2.9 - v t att attack time when v bb jumps below v bb(th) - 1 - ms m ute receive v dlc(th) threshold voltage required on pin dlc/ muter to obtain mute receive condition v gnd - 0.4 - 0.2 v i dlc(th) threshold current sourced by pin dlc/ muter in mute receive condition v dlc = 0.2 v - 100 -m a d g vrxm voltage gain reduction in mute receive condition v dlc < 0.2 v - 80 - db envelope and noise detectors (tsen, tenv, rsen, renv, rnoi and tnoi) p reamplifiers g v(tsen) voltage gain from mic to tsen 37.5 40 42.5 db g v(rsen) voltage gain between rin1 and rin2 to rsen - 2.5 0 +2.5 db l ogarithmic compressor and sensitivity adjustment d v det(tsen) sensitivity detection on pin tsen; voltage change on pin tenv when doubling the current from tsen i tsen = 0.8 to 160 m a - 18 - mv d v det(rsen) sensitivity detection on pin rsen; voltage change on pin renv when doubling the current from rsen i rsen = 0.8 to 160 m a - 18 - mv s ignal envelope detectors i source(env) maximum current sourced from pin tenv or renv - 120 -m a i sink(env) maximum current sunk by pin tenv or renv 0.75 1 1.25 m a d v env voltage difference between pins renv and tenv when 10 m a is sourced from both rsen and tsen; envelope detectors tracking; note 3 - 3 - mv symbol parameter conditions min. typ. max. unit
1996 jul 15 17 philips semiconductors product speci?cation hands free ic tea1094; tea1094a notes 1. corresponds to 50 mw output power. 2. corresponds to 200 mw output power. 3. corresponds to 1 db tracking. 4. corresponds to 4.3 db noise/speech recognition level. n oise envelope detectors i source(noi) maximum current sourced from pins tnoi or rnoi 0.75 1 1.25 m a i sink(noi) maximum current sunk by pins tnoi or rnoi - 120 -m a d v noi voltage difference between pins rnoi and tnoi when 5 m a is sourced from both rsen and tsen; noise detectors tracking; note 3 - 3 - mv d ial tone detector v rindt(rms) threshold level at pins rin1 and rin2 (rms value) - 127 - mv decision logic (idt and swt) s ignal recognition d v srx(th) threshold voltage between pins renv and rnoi to switch-over from receive to idle mode v rin < v rindt ; note 4 - 13 - mv d v stx(th) threshold voltage between pins tenv and tnoi to switch-over from transmit to idle mode note 4 - 13 - mv s witch - over i source(swt) current sourced from pin swt when switching to receive mode 7.5 10 12.5 m a i sink(swt) current sunk by pin swt when switching to transmit mode 7.5 10 12.5 m a i idle(swt) current sourced from pin swt in idle mode - 0 -m a voice switch (stab and swr) swra switching range - 40 - db d swra switching range adjustment with r swr referenced to 365 k w - 40 - +12 db | d g v | voltage gain variation from transmit mode to idle mode on both channels - 20 - db g tr gain tracking (g vtx +g vrx ) during switching, referenced to idle mode - 0.5 - db symbol parameter conditions min. typ. max. unit
1996 jul 15 18 philips semiconductors product speci?cation hands free ic tea1094; tea1094a fig.12 test circuit. handbook, full pagewidth mge439 vol dlc/muter tnoi tenv tsen rnoi renv rsen gnd micgnd rin2 rin1 gat mout pd (1) mutet idt swt stab swr v bb mic gar lsp 20 (16) 21 (17) 2 (2) 3 (3) 18 (14) 8 (6) 25 (21) 24 (20) 28 (24) 27 (23) 26 (22) 23 (19) 1 (1) 11 (8) 6 (5) 5 (4) 22 (18) 10 (7) 12 (9) 13 (10) 14 (11) 16 (12) 19 (15) (13) r swr 365 k w r stab 3.65 k w c swt 220 nf r idt 2.2 m w 30.1 k w r gat c gat c rin2 c rin1 220 nf 220 nf r rsen c rsen c renv c rnoi c tnoi c tsen c tenv c dlc 4.7 m f 4.7 m f 100 nf 470 nf 470 nf r tsen 10 k w r vol c gar r gar 66.5 k w c mic 220 nf v mic v vbb c vbb 10 m f tea1094 tea1094a c lsp 47 m f r l 50 w v rin1 10 k w 100 nf 470 nf the pin numbers given in parenthesis refer to the tea1094a. (1) tea1094a only.
1996 jul 15 19 philips semiconductors product speci?cation hands free ic tea1094; tea1094a application information bo ok, full pagewidth mge440 c7 100 nf c8 100 nf 20 w r9 c1 100 m f 620 w r1 v cc ln mic - mic + qr + v ee slpe line tea106x vol dlc/muter tnoi tenv tsen rnoi renv rsen gnd micgnd rin2 rin1 gat mout pd (1) mutet idt swt stab swr v bb mic gar lsp 20 (16) 21 (17) 2 (2) 3 (3) 18 (14) 8 (6) 25 (21) 24 (20) 28 (24) 27 (23) 26 (22) 23 (19) 1 (1) 11 (8) 6 (5) 5 (4) 22 (18) 10 (7) 12 (9) 13 (10) 14 (11) 16 (12) 19 (15) (13) r swr 365 k w r stab 3.65 k w c swt 220 nf r idt 2.2 m w 30.1 k w r gat c gat c rin1 100 nf r rsen c rsen c renv c rnoi c tnoi c tsen c tenv c dlc 4.7 m f 4.7 m f 100 nf 470 nf 470 nf r tsen 10 k w r vol c gar r gar 66.5 k w c mic 100 nf v vbb c vbb 10 m f tea1094 tea1094a c lsp 47 m f 50 w r lsp 10 k w 100 nf 470 nf r mic 2.2 k w fig.13 basic application diagram. the pin numbers given in parenthesis refer to the tea1094a. (1) tea1094a only.
1996 jul 15 20 philips semiconductors product speci?cation hands free ic tea1094; tea1094a b ook, full pagewidth mge441 micro- controller dp dtmf dtmf 100 nf 100 nf c7a c7b c vbb 10 m f v vbb r mic 2.2 k w c mic 100 nf c8 2.2 k w tea1094 tea1094a mutet pd (1) v bb mic c lsp 50 w lsp 10 (7) 22 (18) c rin1 100 nf 2 (2) mout rin1 micgnd gnd 20 (16) 18 (14) 8 (6) tea106x mic - mic + qr + ln v cc 10 m f s2 20 w r9 tip ring 620 w r1 1 k w 100 m f s1 slpe v ee lsp 6 (5) (13) 19 (15) from microcontroller 100 m f c1 interrupter fig.14 application example. the pin numbers given in parenthesis refer to the tea1094a. (1) tea1094a only.
1996 jul 15 21 philips semiconductors product speci?cation hands free ic tea1094; tea1094a package outlines unit a max. 1 2 b 1 (1) (1) (1) cd e w em h l references outline version european projection issue date iec jedec eiaj mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot117-1 92-11-17 95-01-14 a min. a max. b z max. m e e 1 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 3.9 3.4 0.25 2.54 15.24 15.80 15.24 17.15 15.90 1.7 5.1 0.51 4.0 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.15 0.13 0.01 0.10 0.60 0.62 0.60 0.68 0.63 0.067 0.20 0.020 0.16 051g05 mo-015ah m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 28 1 15 14 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. handbook, full pagewidth dip28: plastic dual in-line package; 28 leads (600 mil) sot117-1
1996 jul 15 22 philips semiconductors product speci?cation hands free ic tea1094; tea1094a unit a max. 1 2 b 1 cd e e m h l references outline version european projection issue date iec jedec eiaj mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot101-1 92-11-17 95-01-23 a min. a max. b w m e e 1 1.7 1.3 0.53 0.38 0.32 0.23 32.0 31.4 14.1 13.7 3.9 3.4 0.25 2.54 15.24 15.80 15.24 17.15 15.90 2.2 5.1 0.51 4.0 0.066 0.051 0.021 0.015 0.013 0.009 1.26 1.24 0.56 0.54 0.15 0.13 0.01 0.10 0.60 0.62 0.60 0.68 0.63 0.087 0.20 0.020 0.16 051g02 mo-015ad m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 24 1 13 12 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. z max. (1) (1) (1) dip24: plastic dual in-line package; 24 leads (600 mil) sot101-1
1996 jul 15 23 philips semiconductors product speci?cation hands free ic tea1094; tea1094a unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot136-1 x 14 28 w m q a a 1 a 2 b p d h e l p q detail x e z c l v m a e 15 1 (a ) 3 a y 0.25 075e06 ms-013ae pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.71 0.69 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale so28: plastic small outline package; 28 leads; body width 7.5 mm sot136-1 95-01-24 97-05-22
1996 jul 15 24 philips semiconductors product speci?cation hands free ic tea1094; tea1094a unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot137-1 x 12 24 w m q a a 1 a 2 b p d h e l p q detail x e z c l v m a 13 (a ) 3 a y 0.25 075e05 ms-013ad pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.61 0.60 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 e 1 0 5 10 mm scale so24: plastic small outline package; 24 leads; body width 7.5 mm sot137-1 95-01-24 97-05-22
1996 jul 15 25 philips semiconductors product speci?cation hands free ic tea1094; tea1094a unit a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm 0.21 0.05 1.80 1.65 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 1.25 7.9 7.6 0.9 0.7 0.8 0.4 8 0 o o 0.13 0.1 0.2 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.20 mm maximum per side are not included. 1.03 0.63 sot340-1 mo-150ag 93-09-08 95-02-04 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 112 24 13 0.25 y pin 1 index 0 2.5 5 mm scale ssop24: plastic shrink small outline package; 24 leads; body width 5.3 mm sot340-1 a max. 2.0
1996 jul 15 26 philips semiconductors product speci?cation hands free ic tea1094; tea1094a soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). dip s oldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. r epairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. so and ssop r eflow soldering reflow soldering techniques are suitable for all so and ssop packages. reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal conduction by heated belt. dwell times vary between 50 and 300 seconds depending on heating method. typical reflow temperatures range from 215 to 250 c. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 minutes at 45 c. w ave soldering wave soldering is not recommended for ssop packages. this is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. if wave soldering cannot be avoided, the following conditions must be observed: a double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. the longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. even with these conditions, only consider wave soldering ssop packages that have a body width of 4.4 mm, that is ssop16 (sot369-1) or ssop20 (sot266-1) . during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 c within 6 seconds. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. r epairing soldered joints fix the component by first soldering two diagonally- opposite end leads. use only a low voltage soldering iron (less than 24 v) applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
1996 jul 15 27 philips semiconductors product speci?cation hands free ic tea1094; tea1094a definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.
internet: http://www.semiconductors.philips.com/ps/ (1) tea1094_3 june 26, 1996 11:51 am philips semiconductors C a worldwide company ? philips electronics n.v. 1996 sca50 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 83749, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland: ul. lukiska 10, pl 04-123 warszawa, tel. +48 22 612 2831, fax. +48 22 612 2327 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 926 5361, fax. +7 095 564 8323 singapore: lorong 1, toa payoh, singapore 1231, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 7430 johannesburg 2000, tel. +27 11 470 5911, fax. +27 11 470 5494 south america: rua do rocio 220, 5th floor, suite 51, 04552-903 s?o paulo, s?o paulo - sp, brazil, tel. +55 11 821 2333, fax. +55 11 829 1849 spain: balmes 22, 08007 barcelona, tel. +34 3 301 6312, fax. +34 3 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 632 2000, fax. +46 8 632 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2686, fax. +41 1 481 7730 taiwan: philips taiwan ltd., 23-30f, 66, chung hsiao west road, sec. 1, p.o. box 22978, taipei 100, tel. +886 2 382 4443, fax. +886 2 382 4444 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: talatpasa cad. no. 5, 80640 gltepe/istanbul, tel. +90 212 279 2770, fax. +90 212 282 6707 ukraine: philips ukraine, 2a akademika koroleva str., office 165, 252148 kiev, tel. +380 44 476 0297/1642, fax. +380 44 476 6991 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 181 730 5000, fax. +44 181 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 708 296 8556 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 825 344, fax.+381 11 635 777 for all other countries apply to: philips semiconductors, marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 34 waterloo road, north ryde, nsw 2113, tel. +61 2 9805 4455, fax. +61 2 9805 4466 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 200 733, fax. +375 172 200 773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 689 211, fax. +359 2 689 102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 708 296 8556 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: prags boulevard 80, pb 1919, dk-2300 copenhagen s, tel. +45 32 88 2636, fax. +45 31 57 1949 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 615 800, fax. +358 615 80920 france: 4 rue du port-aux-vins, bp317, 92156 suresnes cedex, tel. +33 1 40 99 6161, fax. +33 1 40 99 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 23 52 60, fax. +49 40 23 536 300 greece: no. 15, 25th march street, gr 17778 tavros, tel. +30 1 4894 339/911, fax. +30 1 4814 240 hungary: see austria india: philips india ltd, shivsagar estate, a block, dr. annie besant rd. worli, mumbai 400 018, tel. +91 22 4938 541, fax. +91 22 4938 722 indonesia: see singapore ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 648 1007 italy: philips semiconductors, piazza iv novembre 3, 20124 milano, tel. +39 2 6752 2531, fax. +39 2 6752 2557 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108, tel. +81 3 3740 5130, fax. +81 3 3740 5077 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +1 800 234 7381, fax. +1 708 296 8556 middle east: see italy printed in the netherlands 417021/1200/03/pp28 date of release: 1996 jul 15 document order number: 9397 750 00926

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